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January 19, 2010
By: DAVID SAVASTANO
As companies start volume production of printed electronics products, they’re finding they need tighter control of specifications in their substrate and barrier films, and are looking to some possible solutions from the electronics industry to help solve the problem. Printed electronics producers at a recent FlexTech Alliance workshop, hosted by the semiconductor manufacturing trade association SEMI in San Jose, all complained that the rolls of flexible substrates...
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